What are the requirements for substrate in etching process?
1. Effect of etching on cleaning substrate
Etching process Note:
A: During the whole process of etching, the substrate shall be polished, cleaned, then taken out from the water to printing and drying. Gloves shall be worn for operation, and it must not be touched directly by hand.
B. Etching, polishing and cleaning of substrate shall reach all hydrophilic surfaces, and there shall be no spots after air drying.
2. Make a screen printing plate before etching
With 300 mesh polyester screen plate making, the bridge performance is good, and the residual glue of etching should be flushed completely without trachoma and broken line.
3. Screen printing ink should be selected for etching
The etching process adopts metal screen printing ink with acid resistance, alkali resistance, temperature resistance and strong covering power.
4. Dry all fine screen printing
The etching process selects the glue with medium and low hardness to scrape and repeat the ink screen printing. The ink layer is thick and uniform without broken lines and trachoma. After printing, one color is baked for one color (100 ℃, 10 minutes). After printing, it is dried at 150 ℃ for 1.5 hours.
5. Degreasing before plating for etching
After drying, soak it in room temperature degreasing agent (heating to 60 ℃) for 5-10 seconds to remove oil, and then clean and check whether the non printed area is completely hydrophilic. If the etching process fails to meet the requirements, it can be washed with a nylon brush to stop hydrophilicity.
6. Direct nickel and gold (silver) plating by etching
In general, etching and electroplating are copper plating first and then gold (silver), while the pH value of copper plating solution is 0-1, and the pH value of nickel tank and gold tank is 3.8-4.6. At present, there is no acid resistant ink with pH value of 0-1 in the world. (the acid resistance of Seiko 1300# ink is pH 3). Therefore, nickel is directly plated in etching to avoid strong acid, and nickel is used to increase and brighten. Although the speed is slower and the cost is higher, it has little impact on products with high value-added coefficient and small batch. During nickel plating, the current is 30A and the voltage is 5V. The cathode moves. It takes 18-20 minutes to increase by 0.3mm. The demand increases again and can be delayed. Gold (silver) plating after cleaning.
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